GaN Power Amplifier Technology
AmpliVisionS develops high-power GaN solid-state RF amplifiers for demanding broadband applications. With more than ten years of experience in power amplifier development and engineering, we focus on reliable performance, competitive cost, and practical RF solutions for demanding applications.
GaN Device & Thermal Engineering
GaN technology enables high power density and excellent RF performance, but also places higher demands on thermal management. Effective heat removal from the active region is essential for maximizing output power and long-term reliability. From bare-die selection and die attach to thermal spreader and baseplate design, we pay close attention to every stage of the thermal path. High-thermal-conductivity die-attach materials, such as AuSn eutectic, can help reduce thermal resistance compared with conventional silver epoxy. Precise process control is equally important, as even small voids beneath the die can increase thermal resistance. We use techniques such as vacuum die attach and C-SAM (Scanning Acoustic Microscopy) inspection to identify and minimize potential defects.
Measurement-Driven RF Design
Accurate device modeling is critical to high-performance GaN amplifier design. Because GaN device models may not fully represent specific operating conditions, our design approach combines simulation, measured data, and practical engineering experience. Measured load-pull data is used to determine optimum output impedance and maximize RF power, while simulation models are refined according to actual device behavior and design conditions. For linear-operation analysis, measured small-signal S-parameters are also used to validate and correlate simulation results.
Broadband SSPA Technology & Custom Solutions
Our solid-state amplifier technology covers wideband high-efficiency matching, broadband linearization, high-linearity cascade design, and wideband equalization. These technologies enable high output power, high efficiency, high linearity, broadband performance, and compact form factors.
From GaN device selection and thermal management to RF matching, linearization, equalization, and system integration, we support the complete RF power amplification chain. Whether you need a standard amplifier module, a subsystem, support for existing designs, or a customized design, AmpliVisionS provides practical solutions tailored to your RF power, efficiency, linearity, thermal, and reliability requirements.
AmpliVisionS
Tell: +86(28)61892455
E-mail: info@amplivisions.com
Address: 611731, 555 Tianjiao Road, High-Tech (West) Zone, Chengdu City, P.R. China
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